Minimize machining deformation for large oxygen-free copper parts
Oxygen-free copper is soft and prone to cutting-induced warpage after deep grooving on large cold plates. With optimized tooling fixtures and layered cutting strategies, we control deformation strictly to guarantee flatness and assembly sealing performance, eliminating the risk of liquid leakage.
Strict cleanliness control for complex internal flow channels
Deep, intricate flow-channel cavities easily trap copper/swarf chips, which may clog pipelines or damage server pumps. Our specialized deburring plus high-pressure flushing process ensures zero residual metal debris inside cavities to meet liquid-cooling cleanliness standards.
High-precision matched fitting for valve spool & sleeve
Valve assemblies demand tight-clearance sliding sealing with strict coaxiality and roundness. Poor machining causes sticking or fluid leakage. We implement matched precision grinding to achieve smooth sliding while maintaining reliable high-pressure sealing.
Fast turnaround for multi-variant low-volume orders
AI liquid-cooling projects iterate rapidly with frequent prototype updates and mixed small-batch orders. We provide quick drawing evaluation, custom tooling and short lead times to support OEM customization for fast-moving computing projects.
Anti-oxidation protection for oxygen-free copper workpiece
Bare oxygen-free copper oxidizes quickly. Oxidation degrades thermal conductivity and brings assembly contamination. Our passivation treatment prevents oxidation during storage and final assembly.
Full-process traceability & verified leak-proof performance
Liquid-cooling leakage can destroy costly AI chips. Every batch undergoes pressure leak‑testing to deliver reliable, risk-free components.